GIGABYTE B550 AORUS PRO AC AM4 AMD B550 ATX Motherboard

  • Supports AMD Ryzen™ 5000 Series / 3rd Gen Ryzen™ and 3rd Gen Ryzen™ with Radeon™ Graphics Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • True 12+2 Phases Digital VRM Solution with 50A DrMOS
  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
  • Ultra Durable™ PCIe 4.0 Ready x16 Slot
  • Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
  • Onboard Intel® Dual Band 802.11ac & BT 4.2 Wireless with AORUS Antenna
  • AMP-UP Audio with ALC1220-VB and WIMA Capacitors for Rear 120dB SNR
  • Blazing Fast 2.5GbE LAN with Bandwidth Management
  • USB 3.2 Gen2 Type-C™ & HDMI Support
  • RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips
  • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
  • Pre-installed IO Shield for Easy and Quick Installation
Product Code: B550-AORUS-PRO-AC
Brand: Gigabyte
Price Updated On: 26 May, 2021
Availability: Out of Stock
Rs. 40,999

AMD B550 AORUS Motherboard with True 12+2 Phases Digital VRM, Fins-Array Heatsink, Direct-Touch Heatpipe, Dual PCIe 4.0/3.0 x4 M.2 with Thermal Guards, Intel® 802.11ac Wireless, 2.5GbE LAN, RGB FUSION 2.0, Q-Flash Plus

AMD StoreMI Technology

GIGABYTE B550 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:

  • Making the PC experience fast, smooth and easy• Optimizing computer responsiveness from system boot to application launch• Offering SSD performance with HDD capacity at an affordable cost• Quickly accessing key files by automatically learning users' computing behaviors

ULTIMATE POWER DESIGN

To fully support the latest 3rd Gen AMD Ryzen™ processors, B550 motherboards equip with the ultimate power solution which is true direct, digital and multiple phases. After countless experiments and testing, GIGABYTE presents the unbeatable B550 motherboards for enthusiast. No Compromise and never stop to achieve higher.

True 12+2 Phases Digital Power Design

B550 AORUS PRO AC motherboard uses an True 12+2 phases digital power design which includes PWM controller, doublers and DrMOS. These 100% digital controller offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from 3rd Gen AMD Ryzen™ processors.
  • Digital PWM Controller delivers appropriate voltage to the CPU.
  • True 12+2 Phases DrMOS with PWM Doublers design to deliver stable power to the CPU. With capability to handle up to 700 Amps current in a total.
  • All-solid capacitors to improve Transient response and minimize oscillation.
  • 24pin+8pin Solid Pin CPU Power Connectors.

UNPARALLELED PERFORMANCE

  • GIGABYTE realize that customer won't stop chasing a better computing performance. We take care of it and implement on products. Protective and optimized memory trace enhance the performance. Faster read and write are needed to save time and improve efficiency. We offer plenty of M.2 storage with thermal guards to ensure unthrottled read and write. In advance, adopting PCIe 4.0 ready components get the B550 motherboards easier to upgrade.

Support for DDR4 XMP Up to 5400MHz and Beyond*

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

ADVANCED THERMAL SOLUTION

Unthrottled performance is guaranteed by the advanced thermal solution which including Fins-Array Heatsink, Direct Touch Heatpipe and Thermal Guards. B550 AORUS motherboards are cool on MOSFETs and M.2 SSDs even on full loading. It provides lower temperatures for enthusiasts, overclockers and professional gamers.

NEXT GENERATION CONNECTIVITY

A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B550 AORUS motherboards provide all next generation network and storage to keep you up to speed.

 Product Details

CPU

  • AMD Socket AM4, support for : AMD Ryzen™ 5000 Series / 3rd Generation AMD Ryzen™ processors / 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors
  • (Please refer "CPU Support List" for more information.)

Chipset

  • AMD B550

Memory

  • 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
  • AMD Ryzen™ 5000 series Processors:Support for DDR4 5100(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
  • 3rd Gen AMD Ryzen™ Processors:Support for DDR4 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
  • 3rd Gen AMD Ryzen™ with Radeon™ Graphics processors:Support for DDR4 5400(O.C.) / 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
  • Dual channel memory architecture
  • Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules
  • Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  • Support for Extreme Memory Profile (XMP) memory modules
  • (Please refer "Memory Support List" for more information.)

Onboard Graphics

  • Integrated in the 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors:
  • 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz* Support for HDMI 2.1 version, HDCP 2.3, and HDR.
  • Maximum shared memory of 16 GB

Audio

  • Realtek® ALC1220-VB codec* The back panel line out jack supports DSD audio.
  • High Definition Audio
  • 2/4/5.1/7.1-channel
  • Support for S/PDIF Out

LAN

  • Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)

Wireless Communication module

  • Wi-Fi module
  • WIFI 802.11a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band
  • BLUETOOTH 4.2
  • Support for 11ac wireless standard and up to 433 Mbps data rate* Actual data rate may vary depending on environment and equipment.

Expansion Slots

  • 1? x PCI Express x16 slot (PCIEX16) integrated in the CPU:
  • 3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode
  • 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
  • 1 x PCI Express x16 slot (PCIEX4) integrated in the Chipset:
  • Supporting PCIe 3.0 x4 mode* The M2B_SB connector shares bandwidth with the PCIEX4 slot. The PCIEX4 slot will become unavailable when an SSD is installed in the M2B_SB connectors.
  • 1 x PCI Express x16 slot (PCIEX2) integrated in the Chipset:
  • Supporting PCIe 3.0 x2 mode* The PCIEX2 slot shares bandwidth with the SATA3 4, 5 connectors. The PCIEX2 slot will become unavailable when a device is installed in the SATA3 4 or SATA3 5 connector.
  • 2 x PCI Express x1 slots

Storage Interface

  • 1? x M.2 connector (M2A_CPU) integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
  • 3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs
  • 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs
  • 1 x M.2 connector (M2B_SB) integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
  • support PCIe 3.0 x4/x2 SSDs
  • 6 x SATA 6Gb/s connectors, integrated in the Chipset:
  • Support for RAID 0, RAID 1, and RAID 10

USB

CPU:

  • 3 x USB 3.2 Gen 1 ports on the back panel
  • 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel

Chipset

  • 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
  • 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
  • 2 x USB 3.2 Gen 1 ports available through the internal USB header
  • 2 x USB 2.0/1.1 ports on the back panel
  • Chipset+2 USB 2.0 Hubs:
  • 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)

Internal I/O Connectors

  • 1 x 24-pin ATX main power connector
  • 1 x 8-pin ATX 12V power connector
  • 2 x M.2 Socket 3 connectors
  • 6 x SATA 6Gb/s connectors
  • 1 x CPU fan header
  • 1 x water cooling CPU fan header
  • 4 x system fan headers
  • 2 x system fan/water cooling pump headers
  • 1 x CPU cooler LED strip/RGB LED strip header
  • 2 x addressable LED strip headers
  • 2 x RGB LED strip headers
  • 1 x front panel header
  • 1 x front panel audio header
  • 1 x USB 3.2 Gen 1 header
  • 2 x USB 2.0/1.1 headers
  • 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
  • 2 x temperature sensor headers
  • 1 x Thunderbolt™ add-in card connector
  • 1 x Clear CMOS jumper
  • 1 x Thunderbolt header

Back Panel Connectors

  • 1 x HDMI port
  • 2 x SMA antenna connectors (1T1R)
  • 3 x USB 3.2 Gen 1 ports
  • 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
  • 2 x USB 3.2 Gen 2 Type-A ports (red)
  • 6 x USB 2.0/1.1 ports
  • 1 x Q-Flash Plus button
  • 1 x RJ-45 port
  • 1 x optical S/PDIF Out connector
  • 5 x audio jacks

I/O Controller

  • iTE® I/O Controller Chip

H/W Monitoring

  • Voltage detection
  • Temperature detection
  • Fan speed detection
  • Water cooling flow rate detection
  • Overheating warning
  • Fan fail warning
  • Fan speed control* Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.

BIOS

  • 1 x 256 Mbit flash
  • Use of licensed AMI UEFI BIOS
  • PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Unique Features

  • Support for APP Center* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.@BIOSEasyTuneFast BootGame BoostON/OFF ChargeRGB FusionSmart BackupSystem Information Viewer
  • Support for Q-Flash Plus
  • Support for Q-Flash
  • Support for Xpress Install

Operating System

  • Support for Windows 10 64-bit

Form Factor

  • ATX Form Factor; 30.5cm x 24.4cm
 
No Specifications Found